Effects of fourth alloying additive on microstructures and tensile properties of Sn–Ag–Cu alloy and joints with Cu
作者： K.S. Kim , S.H. Huh , K. Suganuma
DOI: 10.1016/S0026-2714(02)00239-1
关键词: Alloy 、 Intermetallic 、 Ultimate tensile strength 、 Materials science 、 Supercooling 、 Soldering 、 Metallurgy 、 Joint (geology) 、 Microstructure 、 Brittleness
摘要: … Ag 3 Sn and Cu 6 Sn 5 and exhibit improved solder structure. The precipitates of Sn–3Ag–… , Cu does not form Cu 6 Sn 5 precipitates in primary β-Sn grains without Ni. The SAC-0.1Co …
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