Microstructure coarsening during static annealing of 60Sn40Pb solder: III Intermetallic compound growth kinetics
作者： Kang Jung , Hans Conrad
DOI: 10.1007/S11664-001-0116-X
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摘要: The growth of the total (Cu3Sn+Cu6Sn) intermetallic compound layer in Cu-60Sn40Pb solder joints during static annealing at 50°C to 150°C was described by equation hi=ho+Ao exp(−Qa/RT)tp with ho=0–0.3 μm, p=0.38–0.70, Ao=1.9×10−4–3.4×10−4 m/sp, and Qa=25.5–30.9 kJ/mole. These constants are within range those obtained others give values Do Q which reasonable accord for diffusion coefficients Cu3Sn Cu6Sn5 determined couples. deviation time exponent p from ideal 0.5 may be due inaccuracies or errors pertaining measured thickness (especially ho) complex nature process.
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