A comparative fatigue study of solder/electroless-nickel and solder/copper interfaces
作者： Pi Lin Liu , Jian Ku Shang
关键词: Materials science 、 Copper 、 Intermetallic 、 Electroless nickel 、 Eutectic system 、 Phase (matter) 、 Fatigue resistance 、 Composite material 、 Microstructure 、 Soldering
摘要: The fatigue resistance of the interface between electroless–nickel and eutectic tin–lead solder alloy was examined in as-reflowed aged conditions compared to behavior copper/solder under same conditions. In state, solder/electroless-nickel slightly superior that solder/copper interface. However, after long-term aging, became far worse high crack growth rate regime. Examinations interfacial microstructures mechanisms indicated differences two interfaces were not directly related thickness intermetallic phase at interface, as commonly believed, but due mechanisms.
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