Comparison of electromigration for lead-free solder joints of Cu vs. Ni UBM flip chip structure
作者： Vipa Rungyusiri , Chiranut Sa-ngiamsak , Sanchai Harnsoongnoen , Poonsak Intarakul
DOI: 10.1109/ECTICON.2009.5137050
关键词: Current crowding 、 Lead (electronics) 、 Chip 、 Flip chip 、 Metallurgy 、 Soldering 、 Materials science 、 Solder material 、 Electromigration
摘要: Flip chip solder joints made with Cu and Ni underbump metallurgy (UBM) on the under current stressing were studied. The effects of material various thicknesses (5, 10, 15, 20 µm) UBM reliability investigated. used was lead-free (Sn4.0Ag0.5Cu). Time to failure both cases (Cu UBMs) forecasted through physical damage occurring at bump by using two-dimensional Finite Element Method (FEM). simulation results conclude that thicker can enhance electromigration reliability. Moreover, comparison time between structure indicates flip joint is approximately 5% longer than case due lowering crowding effect in which clearly shown simulations.
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