Method of manufacturing high speed printed circuit board interconnects
作者： Achyut Kumar Dutta
DOI:
关键词: Dielectric layer 、 Layer (electronics) 、 Trench 、 Printed circuit board 、 Electrical engineering 、 Line (electrical engineering) 、 Interconnection 、 Transmission (telecommunications) 、 Transmission line 、 Engineering
摘要: Described are methods for fabricating high speed metallic electrical interconnects printed wiring board transmission of a data signal across an interconnect in systems. The trench under line is made using the separate dielectric layer having through holes opened that said and aligned with line. sandwiched between carrying ground conducting case microstrip-type two layers through-holes needed stripline-type Multi-layers lines can be utilizing configuration described.
lens.org 参考文章(3)
Robert Olah, Achyut Kumar Dutta, Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems ,(2005)
Robert Olah, Achyut Kumar Dutta, High-speed flex printed circuit and method of manufacturing ,(2005)
Achyut Kumar Dutta, High speed electrical interconnects and method of manufacturing thereof ,(2008)