Multi-layered high-speed printed circuit boards comprised of stacked dielectric systems

摘要: High speed printed circuit boards (PCBs) are disclosed comprising a dielectrics systems with the back-side trenches, prepregs, signal lines and ground-plans, wherein line ground-plan located on dielectrics. Using of open trenches in substrate help to reduce microwave loss dielectric constant thus increasing carrying interconnects. Thus, according present invention, it is possible provide simple high PCB using conventional material manufacturing which facilitates design circuits controlled bandwidth based trench opening dielectrics, affords excellent reliability. According this interconnect system contains whole portion or interconnects for chips that have opened slot loss.