Process for electroles silver plating

摘要: Process for external current-less deposition of silver on a workpiece having copper surface comprises depositing metal more noble than the in first process step, and second step. The is deposited at rate which fastest half as fast when silver. Preferred Features: palladium or gold. Palladium out an acid solution, preferably sulfuric solution. step regulated by adjusting least one parameter, treatment temperature, and/or composition bath used deposition, using Cu(I) complexing agent.