Method for enhancing the solderability of a surface
作者： Peter Kukanskis , David Sawoska , Ronald Redline
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摘要: A method for enhancing the solderability of a metallic surface is disclosed where plated with an immersion silver plate prior to soldering, which treated additive selected from group consisting fatty amines, amides, quaternary salts, amphateric resinous acids, ethoxylated derivatives any foregoing, and mixtures foregoing. The deposits created are resistant electromigration.
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