In-situ study the morphology, growth kinetics and mechanism of Cu 6 Sn 5 at the SnAgCu/Cu soldering interfaces during the cooling stage
作者： Bingfeng Guo
DOI: 10.1109/ICEPT50128.2020.9202589
关键词: Materials science 、 Nanoparticle 、 Grain boundary 、 Activation energy 、 Morphology (linguistics) 、 Soldering 、 Synchrotron radiation 、 Composite material 、 Precipitation (chemistry) 、 Flux (metallurgy)
摘要: In this paper, the IMC (Cu6Sn5) morphology evolution was observed by using Shanghai Light Source Synchrotron Radiation (SSRF) and high-pressure air technology. Comparing with complete reflow experiments, growth data during cooling stage obtained to study process of typical Cu6Sn5 grain evolution. The results are as follows: (1) interfacial is changed from scallop facet or prism. Liquid channels between grains were also in-situ observed. presence liquid increases diffusion flux Cu boundaries reduces activation energy, indicating that addition Ag can hinder lateral merging boundary heat preservation. Simultaneously, promote vertical get a smaller aspect ratio at Sn-3.5Ag-0.7Cu(SAC3507)/Cu interface than Sn/Cu. (2) thickness follows rule h=kt, which reaction control mechanism precipitation interface. (3) affected pinning effect Ag3Sn nanoparticles flux. Finally, under same soldering conditions, SAC3507/Cu thicker
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