Viscoplastic characterization of novel (Fe, Co, Te)/Bi containing Sn–3.0Ag–0.7Cu lead-free solder alloy
作者： A. M. El-Taher , A. A. Ibrahiem , A. F. Razzk
DOI: 10.1007/S10854-020-03117-Z
关键词:
摘要: A novel alloying elements of TeFeCoBi have been anticipated to modify Sn–3Ag–0.7Cu SAC(307) alloys in various attributes. This study inspects the influence slight/trace addition Te, Fe, and Co besides 2 wt% Bi on enhancement microstructural solidification, thermal behavior, tensile properties alloy. Using field emission-scanning electron microscopy (FE-SEM), analysis indicated that Co, not only inhibited growth large platelet Ag3Sn IMC phase, but also new TeSn, FeSn2, (Cu, Co)6Sn5 phases together with Co3Sn particles were formed eutectic regions verified from EDS analysis. The synergetic these precipitates results significant combination high strength ductility solder. ultimate SAC(307)-TeFeCoBi alloy is found be 58.3 MPa, which 1.7 times higher than corresponding Moreover, was improved by ~ 46% reliability, enriched its dissipation ability plastic energy at processing situations. markedly increased undercooling while maintaining temperature pasty range same levels.
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