The roles of dendritic spacings and Ag3Sn intermetallics on hardness of the SAC307 solder alloy

摘要: Abstract Sn–Ag–Cu alloys have emerged as the most promising lead-free solder series among a number of alternatives. These generally present dendritic Sn-rich matrix surrounded by eutectic mixture (β + α), where β is phase and α Ag 3 Sn intermetallic compound. The study aims to investigate effects ( λ 2 , ) spacings morphology particles on hardness Sn–3.0 wt%Ag–0.7 wt%Cu alloy (SAC307). In order establish correlations between 2,3 transient directional solidification (DS) experiments were performed permitting wide range different microstructures be examined. techniques used for microstructure characterization included dissolution matrix, optical/scanning electron microscopy. A prevailed in entire DS casting. It shown that tends decrease with increase F (eutectic spacing having fiber morphology). Experimental equations relating microstructural are proposed.