Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi

摘要: Abstract In the present study, effects of Ag and Bi additions (1 wt.%) on microstructural, thermal, mechanical electrical properties Sn–5Sb solder alloys were investigated by scanning electron microscopy (SEM), X-ray diffraction (XRD), differential calorimetry (DSC), microhardness tests, four probe measurements. It was observed that melting point alloy decreased with addition Bi. found final microstructure rapidly solidified Sn–5Sb-1X (X = Ag Bi) strictly dependent upon wheel speeds; microstructures changed from a coarse dendritic needle-like structure to refined ultra fine rice-like increasing speed. Cooling rate also effective both properties. all exhibit higher cooling and/or decreasing testing temperature. Similarly, significant improvements 32% 9% in conductivity obtained Bi, respectively. The microstructural evolution based plays crucial role influencing these alloys.