Microstructural development and mechanical properties of a near-eutectic directionally solidified Sn–Bi solder alloy
作者： Bismarck Luiz Silva , Guillaume Reinhart , Henri Nguyen-Thi , Nathalie Mangelinck-Noël , Amauri Garcia
DOI: 10.1016/J.MATCHAR.2015.06.026
关键词:
摘要: … The present study aims to investigate the effects of solidification thermal … Bi solder solidified under unsteady-state conditions. Samples were obtained by upward directional solidification (…
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K.A. Jackson, J.D. Hunt, Lamellar and Rod Eutectic Growth Dynamics of Curved Fronts. pp. 363- 376 ,(1988) , 10.1016/B978-0-08-092523-3.50040-X
Ke, Fanrong, Hu, Xiaowu, Li, Research on lamellar structure and micro-hardness of directionally solidified Sn-58Bi eutectic alloy 中国铸造：英文版. ,vol. 9, pp. 360- 365 ,(2012)
D. J. Fisher, W. Kurz, Fundamentals of Solidification ,(1990)
J. Glazer, Metallurgy of low temperature Pb-free solders for electronic assembly International Materials Reviews. ,vol. 40, pp. 65- 93 ,(1995) , 10.1179/IMR.1995.40.2.65
The characterization of eutectic structures Proceedings of The Royal Society A: Mathematical, Physical and Engineering Sciences. ,vol. 335, pp. 15- 37 ,(1973) , 10.1098/RSPA.1973.0111
Yingxin Goh, A.S.M.A. Haseeb, Mohd Faizul Mohd Sabri, Effects of hydroquinone and gelatin on the electrodeposition of Sn–Bi low temperature Pb-free solder Electrochimica Acta. ,vol. 90, pp. 265- 273 ,(2013) , 10.1016/J.ELECTACTA.2012.12.036
Xiaowu Hu, Yulong Li, Yi Liu, Zhixian Min, Developments of high strength Bi-containing Sn0.7Cu lead-free solder alloys prepared by directional solidification Journal of Alloys and Compounds. ,vol. 625, pp. 241- 250 ,(2015) , 10.1016/J.JALLCOM.2014.10.205
Leonardo R. Garcia, Wislei R. Osório, Leandro C. Peixoto, Amauri Garcia, Mechanical properties of Sn–Zn lead-free solder alloys based on the microstructure array Materials Characterization. ,vol. 61, pp. 212- 220 ,(2010) , 10.1016/J.MATCHAR.2009.11.012
G.A. Chadwick, Eutectic alloy solidification Progress in Materials Science. ,vol. 12, pp. 99- 182 ,(1963) , 10.1016/0079-6425(63)90037-9
José Eduardo Spinelli, Bismarck Luiz Silva, Amauri Garcia, Assessment of Tertiary Dendritic Growth and Its Effects on Mechanical Properties of Directionally Solidified Sn-0.7Cu-xAg Solder Alloys Journal of Electronic Materials. ,vol. 43, pp. 1347- 1361 ,(2014) , 10.1007/S11664-014-3087-4