Evolution of microstructure and physical properties of lead-free Sn–5Sb-Ag rapidly solidified solder alloys
作者： Mohammed A. Amin , Emad M. A. Ahmed , Norah I A Abou Tubaylah
DOI: 10.1007/S00339-021-04539-0
关键词:
摘要: Rapidly solidified (RS) binary Sn–5 wt.% Sb and ternary Sb– x Ag, x = 1, 3 5 solder alloys were prepared in form of ribbons using melt spinning technique (MS). X-ray diffractometer (XRD), scanning electron microscopy (SEM) attached with energy dispersive x-ray (EDX) differential calorimetry (DSC) used to investigate the impacts Ag contents on microstructures properties rapidly alloy. XRD analysis confirmed formation an ultrafine microstructure Ag3Sn intermetallic compound addition a supersaturated solid solution Sn by Ag. Moreover, SEM EDX assigned SnSb as well dissolution β-Sn maximum 20.75 11.7 for Sn-5Sb Sn-5Sb-5Ag ribbons, respectively. The melting point spun was lowered 3.7 °C, 1.7 5.4 °C 2.3 0, 1, containing deduced DSC. exhibit better Vickers hardness due refinements extension solubilities alloying elements.
springer.com
sci-hub.st 参考文章(25)
Ercan Karaköse, M. Fatih Kılıçaslan, Hakan Çolak, Formation of novel rice-like intermetallic phases and changes in the mechanical, microstructural and electrical properties of Sn–5Sb alloys with addition Ag and Bi Journal of Alloys and Compounds. ,vol. 655, pp. 378- 388 ,(2016) , 10.1016/J.JALLCOM.2015.09.057
E. M. Ahmed, Physical properties of Zn- 22 wt.% Al- x wt.% Ce melt spun eutectoid alloy Crystal Research and Technology. ,vol. 47, pp. 689- 695 ,(2012) , 10.1002/CRAT.201200095
A.A. El-Daly, A.Z. Mohamad, A. Fawzy, A.M. El-Taher, Creep behavior of near-peritectic Sn-5Sb solders containing small amount of Ag and Cu Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 528, pp. 1055- 1062 ,(2011) , 10.1016/J.MSEA.2010.11.001
A.A. El-Daly, Y. Swilem, A.E. Hammad, Creep properties of Sn–Sb based lead-free solder alloys Journal of Alloys and Compounds. ,vol. 471, pp. 98- 104 ,(2009) , 10.1016/J.JALLCOM.2008.03.097
C. W. Fairhurst, J. B. Cohen, The crystal structures of two compounds found in dental amalgam: Ag2Hg3 and Ag3Sn Acta Crystallographica Section B Structural Crystallography and Crystal Chemistry. ,vol. 28, pp. 371- 378 ,(1972) , 10.1107/S0567740872002432
Rizk Mostafa Shalaby, Influence of indium addition on structure, mechanical, thermal and electrical properties of tin–antimony based metallic alloys quenched from melt Journal of Alloys and Compounds. ,vol. 480, pp. 334- 339 ,(2009) , 10.1016/J.JALLCOM.2009.02.013
M. Kangooie, R. Mahmudi, A.R. Geranmayeh, Impression Creep of a Lead-Free Sn-1.7Sb-1.5Ag Solder Reinforced by Submicron-Size Al2O3 Particles Journal of Electronic Materials. ,vol. 39, pp. 215- 222 ,(2010) , 10.1007/S11664-009-0971-4
Sinn-Wen Chen, Chih-Chi Chen, Wojcieh Gierlotka, An-Ren Zi, Po-Yin Chen, Hsin-Jay Wu, Phase Equilibria of the Sn-Sb Binary System Journal of Electronic Materials. ,vol. 37, pp. 992- 1002 ,(2008) , 10.1007/S11664-008-0464-X
K. Chattopadhyay, R. Goswami, MELTING AND SUPERHEATING OF METALS AND ALLOYS Progress in Materials Science. ,vol. 42, pp. 287- 300 ,(1997) , 10.1016/S0079-6425(97)00030-3
Qiulian Zeng, Jianjun Guo, Xiaolong Gu, Xinbing Zhao, Xiaogang Liu, Wetting Behaviors and Interfacial Reaction between Sn-10Sb-5Cu High Temperature Lead-free Solder and Cu Substrate Journal of Materials Science & Technology. ,vol. 26, pp. 156- 162 ,(2010) , 10.1016/S1005-0302(10)60026-6