Influence of un-cured PDMS chains in stamp using PDMS-based lithography
作者： Jinook Kim , Mikyung Park , Gee Sung Chae , In-Jae Chung
DOI: 10.1016/J.APSUSC.2008.02.074
关键词: Hildebrand solubility parameter 、 Surface diffusion 、 Swelling 、 PDMS stamp 、 Lithography 、 Elastomer 、 Polymer 、 Materials science 、 Contact angle 、 Analytical chemistry 、 Chemical engineering
摘要: We present the compatibility of elastomeric stamp, poly (dimethylsiloxane)(PDMS), with inks for non-photolithography. This ink limitation is important in considering the lamination of …
harvard.edu
elsevier.com
sci-hub.se 参考文章(22)
Günter Reiter, Dewetting of Highly Elastic Thin Polymer Films Physical Review Letters. ,vol. 87, pp. 186101- ,(2001) , 10.1103/PHYSREVLETT.87.186101
J.Y. Lai, Y.Y. Lin, Y.L. Denq, S.S. Shyu, J.K. Chen, Surface modification of silicone rubber by gas plasma treatment Journal of Adhesion Science and Technology. ,vol. 10, pp. 231- 242 ,(1996) , 10.1163/156856196X00364
Xiangjun Wang, Mattias Östblom, Tomas Johansson, Olle Inganäs, PEDOT surface energy pattern controls fluorescent polymer deposition by dewetting Thin Solid Films. ,vol. 449, pp. 125- 132 ,(2004) , 10.1016/J.TSF.2003.10.153
Diana B. H. Chua, H. T. Ng, Sam F. Y. Li, Spontaneous formation of complex and ordered structures on oxygen-plasma-treated elastomeric polydimethylsiloxane Applied Physics Letters. ,vol. 76, pp. 721- 723 ,(2000) , 10.1063/1.125873
Dario Pisignano, Luana Persano, Roberto Cingolani, Giuseppe Gigli, Francesco Babudri, Gianluca M. Farinola, Francesco Naso, Soft molding lithography of conjugated polymers Applied Physics Letters. ,vol. 84, pp. 1365- 1367 ,(2004) , 10.1063/1.1644921
Z. Bao, V. Kuck, J.A. Rogers, M.A. Paczkowski, Silsesquioxane Resins as High-Performance Solution Processible Dielectric Materials for Organic Transistor Applications Advanced Functional Materials. ,vol. 12, pp. 526- 531 ,(2002) , 10.1002/1616-3028(20020805)12:8<526::AID-ADFM526>3.0.CO;2-S
Y. S. Kim, K. Y. Suh, Hong H. Lee, Fabrication of three-dimensional microstructures by soft molding Applied Physics Letters. ,vol. 79, pp. 2285- 2287 ,(2001) , 10.1063/1.1407859
M. Bender, U. Plachetka, J. Ran, A. Fuchs, B. Vratzov, H. Kurz, T. Glinsner, F. Lindner, High resolution lithography with PDMS molds Journal of Vacuum Science & Technology B. ,vol. 22, pp. 3229- 3232 ,(2004) , 10.1116/1.1824057
Jessamine Ng Lee, Cheolmin Park, George M. Whitesides, Solvent compatibility of poly(dimethylsiloxane)-based microfluidic devices. Analytical Chemistry. ,vol. 75, pp. 6544- 6554 ,(2003) , 10.1021/AC0346712
K.Y. Suh, H.H. Lee, Capillary Force Lithography: Large‐Area Patterning, Self‐Organization, and Anisotropic Dewetting Advanced Functional Materials. ,vol. 12, pp. 405- 413 ,(2002) , 10.1002/1616-3028(20020618)12:6/7<405::AID-ADFM405>3.0.CO;2-1