Method and device for bonding a substrate
作者： Sri-Jayantha Sri M , Khanna Vijayeshwar D
DOI:
关键词: Bonding process 、 Semiconductor chip 、 Stress (mechanics) 、 Soldering 、 Breakage 、 Composite material 、 Substrate (printing) 、 Solder ball 、 Clamping 、 Materials science
摘要: The invention relates to a method and device for bonding substrate. A is provided semiconductor chip packaging substrate while minimizing the variation in solder ball heights controlling stress balls During reflow, warp of substrate, including absolute warp, thermal variations constrained at minimal level by providing clamping constraint cool down balls, stresses strains joints are maintained levels that do not cause tear or breakage removing constraint. Thus, process provides both uniform height with minimized non-wets minimization
lens.org 参考文章(10)
Isao Ichikawa, Osamu Yamazaki, Naoya Saiki, Hironori Shizuhata, Adhesive Composition, Adhesive Sheet and Production Process for Semiconductor Device ,(2007)
John Zajac, Stephen Savas, Clamp for holding and efficiently removing heat from workpieces ,(2004)
James D. Parsons, Andrew Devey, Platen for use with a thermal attach and detach system which holds components by vacuum suction ,(2008)
Matthias Lehr, Rainer Giedigkeit, Michael Grillberger, Reduction of Mechanical Stress in Metal Stacks of Sophisticated Semiconductor Devices During Die-Substrate Soldering by an Enhanced Cool Down Regime ,(2010)
Yoshihiro Bessho, Masahiro Ono, Semiconductor unit with semiconductor device mounted with conductive adhesive ,(1997)
Roden Topacio, Neil Mclellan, Vincent Chan, Method for making semiconductor packages ,(2012)
Takahiro Ono, 貴弘 小野, 正生 財賀, Masao Zaiga, Temperature adjusting apparatus for semiconductor substrate ,(2003)
Koshi Kajiaida Jumo Yamaguchi, Base board platform and base board adsorption and peel off method ,(2006)
Li Hongqi, Tin ball welding apparatus ,(2005)
Jang Young Su, Park Hyo Bin, METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD ,(2009)