Systems and methods for reinforced adhesive bonding
作者： Blair E. Carlson , Yongqiang Li , Jeff Wang , Xin Yang
DOI:
关键词:
摘要: A bonding system(100), comprising a first substrate (110), second substrate(120), an adhesive(200), plurality of cavities(240), in contact with surface(115) and surface(125), solder balls(300), the surface(115), positioned adhesive(200) between substrate(110) substrate(120). Also, method to produce solder-reinforced adhesive bond joining applying cavities(240) on substrate(110), positioning each balls(300) at least partially into such that connecting surface(125) substrate(120) portion opposite heat one ball(300) reaches solder-ball temperature.
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