Monte Carlo simulation of damascene electroplating: effects of additives
作者： Y. Kaneko , Y. Hiwatari , K. Ohara , F. Asa
DOI: 10.1080/08927020601067540
关键词: Electroplating 、 Vacancy defect 、 Composite material 、 Deposition (phase transition) 、 Monte Carlo method 、 Copper interconnect 、 Materials science 、 Kinetic Monte Carlo 、 Thin film 、 Crystal growth
摘要: The influence of additives on the filling process via holes in damascene electroplating is investigated with use a kinetic Monte Carlo method. basic system solid-by-solid model for crystal growth which includes vacancy formation during thin film. Three kinds are included to control local surface rate. Inhibitors and levelers have effect preventing deposition, while accelerators increase Levelers modeled stick tips surface. We performed series simulations by changing parameters characterize see their mechanism. It shown that void-free possible combination effects additives.
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