Kinetic Monte Carlo simulation of three-dimensional shape evolution with void formation using Solid-by-Solid model: Application to via and trench filling

摘要: Abstract In this paper we present the Kinetic Monte Carlo simulation system for of three-dimensional shape evolution with void formation as a model electrodeposition. The basic is Solid-by-Solid which an extension conventional Solid-on-Solid crystal growth to include formation. advantage that complex accompanying (from point defects macro voids) can be simulated without difficulty treating moving boundaries. This has been extended solution part in migration ions by coarse-grained random walk. A multi-scale method employed generate concentration gradient diffusion layer. applied via and trench fillings copper Three kinds additives are included: suppressors, accelerators chloride ions. mechanism formation, effects their influence on bottom-up filling discussed within framework model.