Determining the role of w in suppressing crystallization of electroless Ni-W-P films

作者: S. B. Antonelli , T. L. Allen , D. C. Johnson , V. M. Dubin

DOI: 10.1149/1.2193332

关键词: Materials sciencePhase (matter)Differential scanning calorimetryThermal stabilityCrystallographyCrystallizationAmorphous solidChemical engineeringDiffractionTungstenNucleation

摘要: Electroless Ni-W-P films are compared to Ni-P with the same P/Ni ratio in order study role of tungsten stabilizing amorphous state. Differential scanning calorimetry and high-angle X-ray diffraction used these compare their thermal stability crystallization behavior. The results indicate that W inhibits nucleation Ni 3 P phase films, but has limited ability suppress face-centered cubic because is soluble Ni.

参考文章(16)
Thaddeus B Massalski, Hiroaki Okamoto, PRnbsp Subramanian, Linda Kacprzak, William W Scott, None, Binary alloy phase diagrams ASM International. ,vol. 3, pp. 2874- ,(1986)
H. E. Kissinger, Reaction Kinetics in Differential Thermal Analysis Analytical Chemistry. ,vol. 29, pp. 1702- 1706 ,(1957) , 10.1021/AC60131A045
Y. S. Tyan, L. E. Toth, Microstructure of amorphous and crystalline electrodeposited Ni-P and Co-P alloys Journal of Electronic Materials. ,vol. 3, pp. 791- 820 ,(1974) , 10.1007/BF02651399
J. -P. Randin, P. A. Maire, E. Saurer, H. E. Hintermann, DTA and X‐ray Studies of Electroless Nickel Journal of The Electrochemical Society. ,vol. 114, pp. 442- 445 ,(1967) , 10.1149/1.2426623
W. J. Tomlinson, H. G. Rhodes, Kinetics of intermetallic compound growth between nickel, electroless, Ni-P, electroless Ni-B and tin at 453 to 493 K Journal of Materials Science. ,vol. 22, pp. 1769- 1772 ,(1987) , 10.1007/BF01132405
Yi-Ying Tsai, Fan-Bean Wu, Yung-I Chen, Pei-Jun Peng, Jenq-Gong Duh, Su-Yueh Tsai, Thermal stability and mechanical properties of Ni–W–P electroless deposits Surface & Coatings Technology. ,vol. 146, pp. 502- 507 ,(2001) , 10.1016/S0257-8972(01)01462-1
William L. Johnson, Bulk Glass-Forming Metallic Alloys: Science and Technology Mrs Bulletin. ,vol. 24, pp. 42- 56 ,(1999) , 10.1557/S0883769400053252
Chun‐Jen Chen, Kwang‐Lung Lin, The Deposition and Crystallization Behaviors of Electroless Ni‐Cu‐P Deposits Journal of The Electrochemical Society. ,vol. 146, pp. 137- 140 ,(1999) , 10.1149/1.1391576