Method for manufacturing light-emitting device and light-emitting device manufactured by the same

作者: Miyuki Iduka , Akihiro Kojima , Yoshiaki Sugizaki , Yosuke Akimoto , Ryuichi Togawa

DOI:

关键词: Substrate (electronics)OptoelectronicsElectrodeLight emitting deviceLayer (electronics)SemiconductorMaterials scienceLaser light

摘要: A method for manufacturing a light-emitting device (110,111,120,130) is disclosed. The includes removing substrate (10) from semiconductor layer (5). (5) provided on first main surface (10a) of the (10). (33). At least top (5a) and side surfaces (5b) are covered with insulating film (13). electrode portion (14) second (15) electrically continuous to provided. (13) (16). performed by irradiating laser light (LSR) (10b) opposite (10a). Each band-gap energy (16) smaller than (LSR). Also disclosed which can be produced using manufacturing.

参考文章(8)
Li Cheng Shen, Ra Min Tain, Wei Chung Lo, LED wafer-level chip scale packaging ,(2005)
Michael Fehrer, Volker Harle, Stephan Kaiser, Berthold Hahn, Frank Otte, Andreas Plossl, Method for producing a semiconductor component ,(2004)
Masanobu Ando, Shigemi Horiuchi, Yoshinori Kinoshita, Kazuyoshi Tomita, Group III-V semiconductor device and method for producing the same ,(2010)
Arnold Daguio, Qingwei Mo, Robust LED structure for substrate lift-off ,(2007)
Wen-Chieh Huang, Pan-Tzu Chang, James Wang, Chi-Wei Lu, Flip-chip electrode light-emitting element formed by multilayer coatings ,(2005)
Huang-kun Chen, Shih-Peng Chen, Ching-Chuan Shiue, Chao-Min Chen, Manufacturing method of light emitting diode apparatus ,(2008)
Hori Yoshikazu, Matsui Yasushi, Yamamoto Hiroaki, Odani Jiyun, Uno Tomoaki, Serizawa Hiromoto, SEMICONDUCTOR LIGHT EMITTING DEVICE ,(1988)