LED wafer-level chip scale packaging
作者： Li Cheng Shen , Ra Min Tain , Wei Chung Lo
DOI:
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摘要: A structure of light emitting diode (LED) wafer-level chip scale packaging (WL-CSP) is disclosed. The process making the same also provided in this invention. LED CSP utilizes through hole metal filling to enhance heat conduction between die and its carrier substrate. achieved by bonding pre-processed through-hole-filling substrate against flip-chip wafer.
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