Semiconductor light emitting device, light emitting module, and lighting apparatus
作者： Hideo Nagai , Kenji Mukai
DOI:
关键词: Light-emitting diode 、 Light extraction in LEDs 、 Wafer fabrication 、 Optics 、 Optoelectronics 、 Materials science 、 Epitaxy 、 Light emitting device 、 Chip 、 Sic substrate 、 Semiconductor
摘要: An LED array chip (2) includes blue LEDs (6) and red (8) . The are formed by epitaxial growth on an SiC substrate (4). Bonding pads (46 48) the (4) in a wafer fabrication process. separately manufactured from , flip-chip mounted bonding substrate.
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