作者: M Schneider , M Weiser , S Dörfler , H Althues , S Kaskel
DOI: 10.1179/1743294411Y.0000000095
关键词: Carbon 、 Copper 、 Plating 、 Materials science 、 Composite material 、 Chemical vapor deposition 、 Carbon nanotube 、 Electrochemistry 、 Layer (electronics) 、 Cyclic voltammetry
摘要: In this work, the electrochemical deposition of copper on aligned multi-walled carbon nanotubes (MWCNTs) from an aqueous electrolyte is described. The addition sodium dodecyl sulphate has been applied to enhance wettability hydrophobic MWCNT surface. transfer MWCNT–copper composite film nickel substrates, as for chemical vapour process nanotube synthesis, onto adhesive tapes performed. Moreover, a sandwich layer consisting top layers and incorporated interlayer was produced. structure resulting material MWCNTs characterised by scanning electron microscopy. An investigation foil conductive ribbon cyclic voltammetry presented.