Silicon carbide composite, method for producing it and heat dissipation device employing it
作者： Akira c , Mitsuaki c , Hideki c , Kazuyuki c , o Denki Kagaku Kogyo K. K. Nomura
DOI:
关键词: Composite number 、 Composite material 、 Thermal management of electronic devices and systems 、 Aluminium 、 Materials science 、 Component (thermodynamics) 、 Silicon carbide 、 Principal plane 、 Porosity
摘要: A silicon carbide composite which is a flat comprising porous preform of and metal containing aluminum as the main component, infiltrated into preform, said having warpage at most 250 μm per 10 cm principal plane length composite.
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