Laminated electronic module assembly
作者： Timothy S. Fisher , Michael I. Petrites , Alfred G. Ocken , Nathan A. Unterman
DOI:
关键词: Enclosure 、 Structural engineering 、 Heat sink 、 Bent molecular geometry 、 Mechanical engineering 、 Base (geometry) 、 Engineering
摘要: An electronic module assembly includes a relatively thin, bendable base plate having at least one bend axis along which the is bent over on itself to provide an enclosure. inner surface of supports one, and preferably two, thicker metal plates, each side axis, acting as heatsink for circuit components mounted thereon.
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