Electronic module using flexible printed circuit board with heat sink means

摘要: An electronic circuit component having particular utility in multi-layer board construction formed essentially of a flexible dielectric sheet material used as the base to which is attached runs etched from copper sheets clad prior etching. Generally, circuitry are separated according alignment with either X or Y axis on each side being parallel only one those axes. Integration communication between and by means plated through holes elements may be attached. Flatpack integrated circuits oriented their covers toward heat sink portions away board. By placing all flatpacks structure looping back itself, high density can achieved exposed exteriorly loops facilitating conducting contact casing.