Lead‐free solders in Japan (a personal impression)

摘要: Impressions gained from two visits to Japan, discussing with representatives of industry and academe the current status regarding implementation lead‐free technology, are presented. Driven by commercial rewards goods, Japan appears have more clearly articulated targets for removal lead, in advance expected timescales EU legislation. Various strategies combating problems associated higher melting point solder alloys been investigated. Design development generally involve a broader approach than Europe, involving stress analysis, materials properties life prediction underpin empirical data obtained thermal cycling boards. Despite existence several committees facilitate introduction solders, lack cohesion is sometimes apparent, particularly heat treatment prior testing. It proposed that challenge as demanding this would benefit greater collaboration internationally.