A systematic procedure for the selection of a lead‐free solder paste in an electronics manufacturing environment

摘要: Purpose – Historically, tin‐lead solder has been a commonly used joining material in electronics manufacturing. Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restricts use electronics. The transition lead‐free composition is imminent. Several alternative alloys (and their fluxes) researched for assembly last few years. objective this research was develop systematic selection process choosing “preferred” paste, based on its print reflow performance.Design/methodology/approach After detailed study industry preferences, published experimental data, recommendations various industrial consortia, near eutectic tin‐silver‐copper (SAC) selected as preferred alloy evaluation. Commercially available SAC pastes with no‐clean chemistry were extensively investigate...