Thin silicon circuits and method for making the same
作者： Kramadhati V. Ravi
DOI:
关键词: Substrate (electronics) 、 Single crystal 、 Electronic circuit 、 Semiconductor 、 Layer (electronics) 、 Silicon 、 Integrated circuit 、 Materials science 、 Coupling 、 Optoelectronics 、 Electronic engineering
摘要: A method of coupling a single crystal semiconductor layer to support substrate. Thinning the layer. Introducing an integrated circuit into And removing thinned with from
lens.org 参考文章(20)
Joseph J. Bendik, Gerard T. Malloy, Method of making a microelectric device using an alternate substrate ,(1993)
Stanley Wolf, Richard N. Tauber, Silicon Processing for the VLSI Era ,(1986)
Alfred Yi Cho, William Charles Ballamy, Simultaneous molecular beam deposition of monocrystalline and polycrystalline III(a)-V(a) compounds to produce semiconductor devices ,(1974)
Jan Haisma, Franciscus J. H. M. van der Kruis, Method of manufacturing a semiconductor body comprising a carrier wafer and a monocrystalline semiconducting top layer ,(1992)
Peter Ramm, Reinhold Buchner, Method of making a three-dimensional integrated circuit ,(1995)
Mau-Chung F. Chang, Mary K. Szwed, Gerard J. Sullivan, Method of transferring a thin film to an alternate substrate ,(1993)
Volker E. Lehmann, Ulrich M. Goesele, Method of producing a thin silicon on insulator layer by wafer bonding and chemical thinning ,(1990)
Mohendra S. Bawa, David E. Witter, Deposition of silicon at temperatures above its melting point ,(1982)
George K. Celler, Yves Jean Chabal, Single crystal silicon on polycrystalline silicon integrated circuits ,(1999)
Gerard T. Malloy, Ronald M. Finnila, Joseph J. Bendik, Process of manufacturing a microelectric device using a removable support substrate and etch-stop ,(1995)