Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer
作者： Andreas Jakob , Volkmar Stenzel , Klaus-D. Vissing
DOI:
关键词:
摘要: A process and an apparatus are described for the treatment of wafers, in particular thinning wafers. wafer with a carrier layer interlayer arranged between is also described, which plasmapolymeric that adheres to more strongly than wafer.
google.com.br 参考文章(41)
Ichian Tanaka, Manufacturing method of semiconductor device ,(2002)
Tanizawa Yukihiko, MANUFACTURE OF SEMICONDUCTOR DEVICE ,(1994)
Ohnishi Sadayuki, Semiconductor device and manufacturing method thereof ,(2004)
Michael F. Nichols, Allen W. Hahn, Article having a composite insulative coating ,(1989)
Giovanni Antonio Foggiato, Hui Wang, Chung J. Lee, Low dielectric constant materials prepared from photon or plasma assisted chemical vapor deposition and transport polymerization of selected compounds ,(1999)
Jens Höpken, Peter Chabrecek, Dieter Lohmann, Plasma-induced polymer coatings ,(1996)
Stefan Geyer, Wafer level packages for chips with sawn edge protection ,(2004)
Michael F. Nichols, Allen W. Hahn, Process for applying a composite insulative coating to a substrate ,(1990)
Mitsutoshi Nakamura, Shuji Iino, Izumi Osawa, Hideo Hotomi, Photosensitive member composed of amorphous carbon charge transporting layer and charge generating layer ,(1989)
Kramadhati V. Ravi, Thin silicon circuits and method for making the same ,(2000)