Method for separating a layer system comprising a wafer

摘要: The invention relates to a method for mechanically separating laminar structure (8) from carrier assembly (1a) comprising or consisting of first (1), wherein the comprises wafer (7) and optionally second, stretchable (20), following steps: a) providing layer system (1a, 8) (8), b) creating mechanical stress in region boundary surface between so that is separated (1a), by i) i aid (29), fixing (29) on second (20) such that, during operation, remains fixed directly behind front (33) occurring separation, c) using (33), and/or ii) step: vibration 8), iii) changing temperature parts with proviso if does not include steps - c), lead complete separation assembly.