Method and device for peeling semiconductor wafer

摘要: PROBLEM TO BE SOLVED: To provide a semiconductor wafer peeling method and device capable of preventing damage when the from support. An insertion step (a, b) in which 30 adhered to rigid support 20 via an adhesive material 28 is peeled off, member 6 inserted into material. And oscillating (c) for vibrating while urging direction apply vibration adhesive. [Selection] Figure 3