Method for fabricating a semiconductor device and semiconductor production apparatus
作者： Daisuke Yamashita
DOI:
关键词: Semiconductor device 、 Substrate (electronics) 、 Grinding 、 Adhesive 、 Semiconductor production 、 Materials science 、 Composite material 、 Engineering drawing
摘要: A semiconductor production apparatus includes a supporting substrate having an upper surface to which is bonded and lower back side grinding (BSG) tape bonded, stage on peeling positioned such that adhesive of the oriented upwards, handler transfers in state BSG downwards toward onto tape. unit draws peel from substrate.
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