Method of separating and handling a thin semiconductor die on a wafer

摘要: A method of separating a thin die ( 20, 60 ) from support body 72 semiconductor wafer 70 ). The being initially attached to the by an attachment mechanism 78, 178 may be plurality tethers that extend between and include steps of: positioning on rigid backing 110 having hole 112 ), positioned beneath ); tip 128 handler 120 above passageway 146 vacuum source; ejection pin 150 in spaced apart relationship moving downward toward break clamp upward direction until is extracted