A refractory lift‐off process with applications to high‐Tcsuperconducting circuits
作者： R. E. Howard
DOI: 10.1063/1.90258
关键词: Transition temperature 、 Type-II superconductor 、 Refractory metals 、 Optoelectronics 、 Superconductivity 、 Integrated circuit 、 Niobium 、 Stencil 、 Metallurgy 、 Fabrication 、 Materials science 、 Physics and Astronomy (miscellaneous)
摘要: A refractory stencil lift‐off process utilizing Nb/Cu bilayers is described that suitable for materials, such as the high‐transition‐temperature superconductors, which must be deposited on hot (up to 1000 °C) substrates.
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