A Study on the Thermal Oxidation and Wettability of Lead-free Solders of Sn-Ag-Cu and Sn-Ag-Cu-In
作者： Hyunbok Lee , Sang Wan Cho
DOI: 10.5757/ASCT.2014.23.6.345
关键词: Metal 、 Wetting 、 Soldering 、 Materials science 、 Thermal oxidation 、 Layer (electronics) 、 Metallurgy 、 Solder alloy 、 X-ray photoelectron spectroscopy 、 Coating
摘要: The surface oxidation mechanism of lead-free solder alloys has been investigated with multiple reflow using X-ray photoelectron spectroscopy. It was found that the Sn-Ag-Cu-In alloy is surrounded by a thin InOx layer after process; this coating protects metallic from thermal oxidation. Based on result, we have performed wetting balance test at various temperatures. shows characteristics both and better than those Sn-Ag-Cu alloy. Therefore, good candidate to solve two problems easy low wettability, which are most critical Pb-free solders.
koreascience.or.kr
researchgate.net 参考文章(20)
S. Wan Cho, K. Han, Y. Yi, S. J. Kang, K.-H. Yoo, K. Jeong, C.-N. Whang, Thermal Oxidation Study on Lead‐free Solders of Sn‐Ag‐Cu and Sn‐Ag‐Cu‐Ge Advanced Engineering Materials. ,vol. 8, pp. 111- 114 ,(2006) , 10.1002/ADEM.200500188
J. W. Nah, K. W. Paik, J. O. Suh, K. N. Tu, Mechanism of electromigration-induced failure in the 97Pb-3Sn and 37Pb-63Sn composite solder joints Journal of Applied Physics. ,vol. 94, pp. 7560- 7566 ,(2003) , 10.1063/1.1628388
T. L. Shao, Y. H. Chen, S. H. Chiu, Chih Chen, Electromigration failure mechanisms for SnAg3.5 solder bumps on Ti∕Cr-Cu∕Cu and Ni(P)∕Au metallization pads Journal of Applied Physics. ,vol. 96, pp. 4518- 4524 ,(2004) , 10.1063/1.1788837
I. Artaki, A.M. Jackson, P.T. Vianco, Fine Pitch Surface Mount Technology Assembly with Lead‐free, Low Residue Solder Paste Soldering & Surface Mount Technology. ,vol. 7, pp. 27- 32 ,(1995) , 10.1108/EB037896
I. Artaki, A. M. Jackson, P. T. Vianco, Evaluation of lead-free solder joints in electronic assemblies Journal of Electronic Materials. ,vol. 23, pp. 757- 764 ,(1994) , 10.1007/BF02651370
Mui Chee Liew, Ibrahym Ahmad, Liu Mei Lee, Muhammad Firdaus Mohd Nazeri, Habsah Haliman, Ahmad Azmin Mohamad, Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science. ,vol. 43, pp. 3742- 3747 ,(2012) , 10.1007/S11661-012-1194-5
K.S. Kim, S.H. Huh, K. Suganuma, Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints Journal of Alloys and Compounds. ,vol. 352, pp. 226- 236 ,(2003) , 10.1016/S0925-8388(02)01166-0
H. Gan, K. N. Tu, Polarity effect of electromigration on kinetics of intermetallic compound formation in Pb-free solder V-groove samples Journal of Applied Physics. ,vol. 97, pp. 063514- ,(2005) , 10.1063/1.1861151
Deok Kyu Kim, Hong Bae Kim, Investigation of the Annealing Time Effects on the Properties of Sputtered ZnO:Al Thin Films Applied Science and Convergence Technology. ,vol. 23, pp. 366- 370 ,(2014) , 10.5757/ASCT.2014.23.6.366
Junwoo Jeong, NoSoung Myoung, Diffusion Coefficient of Iron in ZnSe Polycrystals from Metal Phase for mid-IR Gain Medium Application Applied Science and Convergence Technology. ,vol. 23, pp. 371- 375 ,(2014) , 10.5757/ASCT.2014.23.6.371