Corrosion Behavior of Sn-3.0Ag-0.5Cu Lead-Free Solder in Potassium Hydroxide Electrolyte
作者： Mui Chee Liew , Ibrahym Ahmad , Liu Mei Lee , Muhammad Firdaus Mohd Nazeri , Habsah Haliman
DOI: 10.1007/S11661-012-1194-5
关键词:
摘要: The corrosion behavior of Sn-3.0Ag-0.5Cu (SAC305) solder alloy in 6 M potassium hydroxide electrolyte was investigated using polarization analysis. results revealed that SAC305 is susceptible to because the dissolution Sn phase. potential (E corr) and current density (i obtained from sample –1.108 V vs Hg/HgO 1.795 × 10−4 A cm−2, respectively. In addition, microstructural elemental characterization presence tin oxide, Cu, and/or Ag-containing product on surface corroded sample. morphology samples also observed contain several pits, cracks, pore-like structures.
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