作者: Nurwahida Binti Mohd Zaini , Muhammad Firdaus Bin Mohd Nazeri
DOI: 10.1063/1.4958759
关键词: Hydrochloric acid 、 Metallurgy 、 Composite material 、 Dissolution 、 Passivation 、 Corrosion 、 Microstructure 、 Materials science 、 Potentiodynamic polarization 、 Soldering 、 Polarization (electrochemistry)
摘要: The corrosion analysis of SAC305 lead free solder was investigated in Hydrochloric acid (HCl) solution. Potentiodynamic polarization used to polarize the SAC305. effect on phase and microstructure were compared as-prepared solder. introduces mixed products surface XRD confirms that emerged after by formation SnO SnO2 which confirmed dissolution Sn dominant during polarization. Microstructure reveal presence gap porosities produced limits protection offered passivation film.