Corrosion behavior assessment of tin-lead and lead free solders exposed to fire smoke generated by burning polyvinyl chloride

作者: Qian Li , Xufei Liu , Shouxiang Lu

DOI: 10.1016/J.MATCHEMPHYS.2018.03.057

关键词:

摘要: Abstract The corrosion characteristics of tin-lead and three lead free solders (Sn-0.7Cu, Sn-3.0Ag Sn-3.0Ag-0.5Cu) exposed to fire smoke generated from polyvinyl chloride (PVC) were comparatively investigated through weight loss method surface characterization techniques. Results show that the rates each four examined rise with increase concentrations over concentration range 20 g/m3 140 g/m3. Sn-37Pb solder exhibits optimal resistance, while Sn-3.0Ag-0.5Cu has much poorer resistance in comparison former, even Sn-0.7Cu alloys. As indicated by SEM XRD, these may be related their microstructure. When alloys involve more intermetallic compounds, larger cathode areas are presented, weaker seems be. Further, XRD Raman spectrum reveal SnO PbCl2 main products solder, those primarily consist Sn21Cl16(OH)14O6 SnO. Accordingly, mechanisms further analyzed.

参考文章(37)
Joel S. Patton, Fire and Smoke Corrosivity of Structural Materials Journal of Fire Sciences. ,vol. 10, pp. 294- 322 ,(1992) , 10.1177/073490419201000403
F. Rosalbino, E. Angelini, G. Zanicchi, R. Carlini, R. Marazza, Electrochemical corrosion study of Sn–3Ag–3Cu solder alloy in NaCl solution Electrochimica Acta. ,vol. 54, pp. 7231- 7235 ,(2009) , 10.1016/J.ELECTACTA.2009.07.030
A. Artigas, A. Monsalve, K. Sipos, O. Bustos, J. Mena, R. Seco, N. Garza-Montes-de-Oca, Development of accelerated wet–dry cycle corrosion test in marine environment for weathering steels Corrosion Engineering Science and Technology. ,vol. 50, pp. 628- 632 ,(2015) , 10.1179/1743278215Y.0000000007
Udit Surya Mohanty, Kwang-Lung Lin, Electrochemical corrosion behaviour of lead-free Sn-8.5 Zn-X Ag-0.1 Al-0.5 Ga solder in 3.5% NaCl solution Materials Science and Engineering A-structural Materials Properties Microstructure and Processing. ,vol. 406, pp. 34- 42 ,(2005) , 10.1016/J.MSEA.2005.05.101
Abdel-Rahman El-Sayed, Hossnia S. Mohran, Hany M. Abd El-Lateef, The inhibition effect of 2,4,6-tris (2-pyridyl)-1,3,5-triazine on corrosion of tin, indium and tin–indium alloys in hydrochloric acid solution Corrosion Science. ,vol. 52, pp. 1976- 1984 ,(2010) , 10.1016/J.CORSCI.2010.02.029
Dezhi Li, Paul P. Conway, Changqing Liu, Corrosion characterization of tin–lead and lead free solders in 3.5 wt.% NaCl solution Corrosion Science. ,vol. 50, pp. 995- 1004 ,(2008) , 10.1016/J.CORSCI.2007.11.025
Ken’ichi Yokoyama, Akihide Nogami, Jun’ichi Sakai, Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution Corrosion Science. ,vol. 86, pp. 142- 148 ,(2014) , 10.1016/J.CORSCI.2014.05.004
Z. Y. Chen, S. Zakipour, D. Persson, C. Leygraf, Effect of Sodium Chloride Particles on the Atmospheric Corrosion of Pure Copper Corrosion. ,vol. 60, pp. 479- 491 ,(2004) , 10.5006/1.3299244
Muhammad Firdaus Mohd Nazeri, Ahmad Azmin Mohamad, Corrosion measurement of Sn–Zn lead-free solders in 6 M KOH solution Measurement. ,vol. 47, pp. 820- 826 ,(2014) , 10.1016/J.MEASUREMENT.2013.10.002
Wislei R. Osório, Emmanuelle S. Freitas, José E. Spinelli, Amauri Garcia, Electrochemical behavior of a lead-free Sn–Cu solder alloy in NaCl solution Corrosion Science. ,vol. 80, pp. 71- 81 ,(2014) , 10.1016/J.CORSCI.2013.11.010