Creep corrosion cracking of Sn-3.0Ag and Sn-0.5Cu solder alloys in NaCl solution
作者： Ken’ichi Yokoyama , Akihide Nogami , Jun’ichi Sakai
DOI: 10.1016/J.CORSCI.2014.05.004
关键词:
摘要: Abstract The surface crack nucleation of Sn–3.0Ag and Sn–0.5Cu solder alloys has been examined by performing sustained tensile-loading tests in 0.9 mass% NaCl solution at room temperature. For alloy, many cracks nucleate propagate on the side specimen, similarly to Sn–3.0Ag–0.5Cu alloy reported previously. such are not observed, ordinary creep deformation occurs solution. effect applied stress, i.e., creep, dissolution ions is smaller for than alloy. present results suggest that there differences susceptibility cracking under stress a solution, corrosion cracking, among lead-free alloys.
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