In Situ Observation of Small-Scale Deformation in a Lead-Free Solder Alloy
作者： Yong Sun , Jin Liang , Zhi-Hui Xu , Guofeng Wang , Xiaodong Li
DOI: 10.1007/S11664-008-0600-7
关键词: Lüders band 、 Grain Boundary Sliding 、 Strain rate 、 Composite material 、 Microstructure 、 Metallurgy 、 Deformation (meteorology) 、 Materials science 、 Deformation mechanism 、 Grain boundary 、 Optical microscope
摘要: In situ observation of the local, small-scale deformation behavior a Sn-Ag-Cu (SAC387) alloy under extremely small strain rates was realized using custom-designed mechanical testing stage integrated with atomic force microscopy (AFM) and optical microscopy. Grain boundary sliding (GBS) hand in grain decohesion (GBD) is dominant mechanism early (<8.0% local strain) while intragranular slip bands are observed large-strain regime for dendritic microstructure at room temperature. The mechanisms SAC387 discussed detail reference to its microstructural constituents properties.
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