Early stage growth characteristics of Ag 3 Sn intermetallic compounds during solid–solid and solid–liquid reactions in the Ag–Sn interlayer system: Experiments and simulations

摘要: Abstract Transient Liquid Phase Bonding (TLPB) makes use of the isothermal solidification a liquid interlayer through formation intermetallic compounds (IMC). This work investigates Ag3Sn IMC in thin, electroplated Ag–Sn system appropriate for TLPB – while covering as-coated conditions, growth initiation up to few minutes holding time with experimental and numerical methods. Both solid-state solid–liquid reactions at 200, 250 300 °C, respectively, were covered under identical near-isothermal conditions novel setup. Morphological aspects like lateral grain size or scallop roughness proven strongly depend on temperature. Growth kinetics captured by power laws, exponents n determined as 0.24, 0.36 0.29, parabolic constants k 1.32 ⋅ 10−11, 4.04 ⋅ 10−10 7.24 ⋅ 10−10 cm2/s activation energy Q 30.6 kJ/mol. Predominant diffusion mechanisms, i.e. volume GB diffusion, well coarsening effects identified temperature dependent early stages. A mathematical model was developed based Arrhenius relationship including correction function zIMC,corr calculate predict time. The study completed multiphase-field simulations which targeted mimic kinetic morphological features various conditions. Good agreement between experiments found limited set parameters allowed drawing conclusions about dominant transport mechanisms reacting elements.