Au–Sn bonding material for the assembly of power integrated circuit module
作者： ZX Zhu , CC Li , LL Liao , CK Liu , CR Kao
DOI: 10.1016/J.JALLCOM.2016.02.065
关键词:
摘要: … The basic principle of SLID bonding is to react at a high melting temperature metal with a low melting temperature metal to form high melting point(s) intermetallic compound(s) [7]. Many …
sci-hub.se 参考文章(25)
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