The early stage dissolution of Ni and the nucleation of Ni–Sn intermetallic compound at the interface during the soldering of Sn–3.5Ag on a Ni substrate

摘要: The early stage soldering reaction, reflow for 5 s at 250 °C followed by a liquid nitrogen quench, of Sn–3.5Ag on an electroplated Ni substrate gives rise to dissolution zone, amorphous Ni–Sn diffusion and nuclei NiSn intermetallic compound within the interfacial region. nucleation takes place interface between zone as well producing 10 nm nanocrystallites. High resolution transmission electron microscope observations indicate that is preliminary forms during reaction.