Effect of Ag3Sn intermetallic compounds on corrosion of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition
作者： Mingna Wang , Jianqiu Wang , Hao Feng , Wei Ke , None
DOI: 10.1016/J.CORSCI.2012.05.006
关键词: Cathodic protection 、 Intermetallic 、 Materials science 、 Metallurgy 、 Alloy 、 Microstructure 、 Corrosion 、 Tin 、 Anode 、 Soldering
摘要: The aim of this study is to evaluate the effects Ag3Sn intermetallic compounds (IMCs) on corrosion Sn-3.0Ag-0.5Cu (SAC305) solder alloy under high-temperature and high-humidity condition. IMCs SAC305 with various size morphology were obtained by changing cooling rate. Commercial smallest exhibits better resistance than air-cooled furnace-cooled solders because microgalvanic between large cathodic plates anodic Sn matrix decreased solders. (c) 2012 Elsevier Ltd. All rights reserved.
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