Led package structure for forming a stuffed convex lens to adjust light-projecting angle and method for manufacturing the same
作者： Fang-Kuei Wu , Chia-Tin Chung
DOI:
关键词: Substrate (printing) 、 Coating 、 Materials science 、 Composite material 、 Engineering drawing 、 Limiting
摘要: An LED package structure includes a substrate unit, light-emitting light-reflecting unit and convex unit. The has body chip-placing area. plurality of chips electrically disposed on the an annular reflecting resin surroundingly formed by coating. surrounds that are area to form position limiting space above area, inner surface been cleaned plasma clean surface. in order cover chips. is limited space.
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