Packages for semiconductor light emitting devices utilizing dispensed reflectors and methods of forming the same
作者： Peter Andrews
DOI:
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摘要: A packaged LED includes a substrate, an chip on the upper surface of first encapsulant material, including reflective substrate and spaced apart from chip, second material chip. method forming meniscus control feature defining region surrounding between feature, mounting within region, dispensing curing material.
lens.org 参考文章(30)
John A. Edmond, Kenneth Irvine, Vladimir Dmitriev, Buffer structure between silicon carbide and gallium nitride and resulting semiconductor devices ,(1994)
Hua-Shuang Kong, Gary E. Bulman, John A. Edmond, Vladimir Dmitriev, Blue light-emitting diode with degenerate junction structure ,(1993)
Cheng-Hsiang Hsu, LED package and the process making the same ,(2004)
Anthony John Springthorpe, Light emitting diodes with high external quantum efficiency ,(1981)
Hong Huat Yeoh, Kian Shin Lee, Meng Ee Lee, Su Lin Oon, Siew It Pang, Phosphor-converted LED devices having improved light distribution uniformity ,(2005)
Hua-Shuang Kong, John Adam Edmond, Double heterojunction light emitting diode with gallium nitride active layer ,(1996)
Alexander V. Suvorov, John A. Edmond, Method of forming green light emitting diode in silicon carbide ,(1994)
Gerald H. Negley, Method for producing high efficiency light-emitting diodes and resulting diode structures ,(1995)
Robert Gengelbach, Bernd Keller, Benjamin Jacobson, Side-emitting optical coupling device ,(2005)