Semiconductor light-emitting device, manufacturing method thereof, and electronic image pickup device
作者： Yasuji Takenaka
DOI:
关键词:
摘要: A semiconductor light-emitting device includes a lead frame having main surface, LED chip, an epoxy resin provided to completely cover the and portion surround chip. The top surface. surface at position where distance from is greater than inner wall on side chip located extending in direction away reach Thus, excellent heat radiation permitting appropriate control of directivity light, manufacturing method thereof, electronic image pickup are provided.
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