Led package and method for making the same
作者： Wen-Liang Tseng , Chia-Chiang Yang
DOI:
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摘要: An LED package includes a substrate, an electrode structure, die, packaging portion, and covering portion. The structure is formed on the substrate. die mounted electrically connected to structure. portion covers die. surrounds periphery of seals joint between made silicone-titanate resin with reactive monomers, wherein monomers comprises more than 60% heptane, 7.0% 13.0% allytrimethoxysilane, 5.0% 10.0% tetrabutyl titanate, less 0.1% tetramethoxysilane.
lens.org 参考文章(3)
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Toshio Ogata, Toshihiko Oyama, Nobuo Kobayashi, Hideyuki Osawa, Semiconductor light emitting device, method for producing the same and reflector for semiconductor light emitting device ,(2003)